Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17000239
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Filing Dt:
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08/21/2020
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Publication #:
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Pub Dt:
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02/24/2022
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Inventors:
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Chun-Wei CHIANG, Chih-Pin HUNG, Yong-Da CHIU, Shin-Luh TARNG, Shiu-Chih WANG
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Title:
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ELECTROLESS SEMICONDUCTOR BONDING STRUCTURE, ELECTROLESS PLATING SYSTEM AND ELECTROLESS PLATING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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