Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17184547
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Filing Dt:
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02/24/2021
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Publication #:
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Pub Dt:
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02/24/2022
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Inventors:
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Kenji KUROKI, Oscar RUIZ, Eduardo TORRES MIRELES
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Title:
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Reduction Of High Tape Contact Pressure Points Against Head Assembly
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5601 GREAT OAKS PARKWAY |
| SAN JOSE, CALIFORNIA 95119 |
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| PATTERSON + SHERIDAN, LLP |
| 24 GREENWAY PLAZA, SUITE 1600 |
| HOUSTON, TX 77046 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| IL1-1145/54/63, P.O. BOX 6026 |
| CHICAGO, ILLINOIS 60680 |
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| WESTERN DIGITAL |
| 951 SANDISK DRIVE |
| LEGAL/MICHELLE DELOS ANGELES |
| MILPITAS, CA 95035 |
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Assignment:
3
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RELEASE OF SECURITY INTEREST AT REEL 056285 FRAME 0292
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| 3355 MICHELSON DRIVE |
| IRVINE, CALIFORNIA 92612 |
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| CSC |
| 1090 VERMONT AVENUE NW, SUITE 430 |
| WASHINGTON, DC 20005 |
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