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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17166104
Filing Dt:
02/03/2021
Publication #:
Pub Dt:
03/03/2022
Inventors:
Yun ZHANG, Xingxing ZHANG, Volker WOHLFARTH, Jing WANG, Peipei DONG, Wei ZHAO
Title:
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
Assignment: 1
Reel/Frame:
059204/0179Recorded: 03/09/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/25/2021
Exec Dt:
01/25/2021
Exec Dt:
03/09/2022
Exec Dt:
01/25/2021
Exec Dt:
01/25/2021
Exec Dt:
01/25/2021
Assignees:
2358 CHANGAN ROAD
WUJIANG
SUZHOU, JIANGSU, CHINA 215200
KLARENBERGSTRASSE 53 - 79
SCHWAEBISCH GMUEND, GERMANY 73525
Correspondent:
SZDC LAW P.C.
1629 K STREET NW, SUITE 300
WASHINGTON, DC 20006

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