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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11668558
Issue Dt:
06/06/2023
Application #:
17214830
Filing Dt:
03/27/2021
Publication #:
20220065618
Pub Dt:
03/03/2022
Inventors:
Jongsu Kim, Wansung Park, Doohyun Cho, Sungha Kim, Jaeyoun Wi, Kijoo Hong, Taejoong Kim et al
Title:
THICKNESS ESTIMATION METHOD AND PROCESSING CONTROL METHOD
Assignment: 1
Reel/Frame:
055888/0328Recorded: 04/12/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIM, JONGSU
Exec Dt:
03/03/2021
PARK, WANSUNG
Exec Dt:
03/03/2021
CHO, DOOHYUN
Exec Dt:
03/03/2021
KIM, SUNGHA
Exec Dt:
03/03/2021
WI, JAEYOUN
Exec Dt:
03/03/2021
HONG, KIJOO
Exec Dt:
03/03/2021
KIM, TAEJOONG
Exec Dt:
03/03/2021
RYU, YOUNGSU
Exec Dt:
03/03/2021
LEE, KWANGSUNG
Exec Dt:
03/03/2021
HONG, MIN
Exec Dt:
03/03/2021
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
MUIR PATENT LAW, PLLC
P.O. BOX 1213
GREAT FALLS, VA 22066

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