Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17407567
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Filing Dt:
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08/20/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Inventors:
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Woon KONG, Ung Jo MOON, Ji Hoon SONG, Ji Ho PARK
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Title:
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WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 132, ANNYEONGNAM-RO |
| HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 18363 |
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| KILE PARK REED & HOUTTEMAN PLLC JAE Y PA |
| 1101 30TH STREET, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20007 |
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05/21/2024 03:09 PM
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