Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17474917
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Filing Dt:
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09/14/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Inventors:
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Steven L. Teig, Kenneth Duong, Ilyas Mohammed, Javier DeLaCruz
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Title:
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3D Processor Having Stacked Integrated Circuit Die
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| JEFFREY NEGRON |
| PAUL HASTINGS LLP |
| 200 PARK AVENUE |
| NEW YORK, NY 10166 |
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