Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17468423
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Filing Dt:
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09/07/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Hsien-Lung HO, Da-Ming CHIANG, Chung-Chieh CHEN
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Title:
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MICRO-ELECTRO-MECHANICAL SYSTEM ACOUSTIC SENSOR, MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11F., NO. 221, SEC. 3, BEIXIN RD., XINDIAN DIST. |
| NEW TAIPEI CITY, TAIWAN 23143 |
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| INNOVATION COUNSEL LLP |
| 2880 ZANKER ROAD |
| SUITE 201 |
| SAN JOSE, CA 95134 |
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