Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/26/2023
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Application #:
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17529769
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Filing Dt:
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11/18/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Junitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
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Title:
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COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRODUCING THE COPPER OXIDE SOLID, AND APPARATUS FOR SUPPLYING A PLATING SOLUTION INTO A PLATING TANK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11-1, HANEDA ASAHI-CHO, OTA-KU |
TOKYO, JAPAN 1448510 |
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BAKERHOSTETLER |
999 THIRD AVENUE |
SUITE 3900 |
SEATTLE, WA 98104-4040 |
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05/02/2024 09:43 AM
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