Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17356473
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Filing Dt:
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06/23/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Weifeng Zhou, Zhuang Liu
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Title:
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BINNING-ENHANCED DEFECT DETECTION METHOD FOR THREE-DIMENSIONAL WAFER STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| HODGSON RUSS LLP |
| 140 PEARL STREET |
| SUITE 100 |
| BUFFALO, NY 14202 |
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