Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17527767
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Filing Dt:
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11/16/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Ji Young Chung, Jin Seong Kim, Se Hwan Hong, Dong Joo Park, Jae Sung Park
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Title:
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SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 W. MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 W. MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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