Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17165479
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Filing Dt:
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02/02/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Wan Choon PARK, Gyu Jei LEE, Jong Hoon KIM, Tae Hun YI
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD FOR FABRICATING THE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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