Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2024
|
Application #:
|
17475612
|
Filing Dt:
|
09/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/17/2022
| | | | |
|
Inventors:
|
Kim NG, On Lok CHAU, Raymond WONG, Wai Keung HO
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING OF A SEMICONDUCTOR PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| JONKERBOSPLEIN 52 |
| NIJMEGEN, NETHERLANDS 6534 AB |
|
|
|
|
| OHLANDT, GREELEY, RUGGIERO & PERLE, LLP |
| ONE LANDMARK SQUARE, 10TH FLOOR |
| STAMFORD, CT 06901-2682 |
|
|
Search Results as of:
05/21/2024 12:49 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
