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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17459856
Filing Dt:
08/27/2021
Publication #:
Pub Dt:
03/17/2022
Inventors:
Hiroshi TOYODA, Takayuki BEPPU, Katsuaki NATORI, Koji YAMAKAWA, Masayuki KITAMURA
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
058370/0765Recorded: 12/13/2021Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/09/2021
Exec Dt:
08/23/2021
Exec Dt:
11/16/2021
Exec Dt:
11/24/2021
Exec Dt:
08/25/2021
Assignee:
1-21, SHIBAURA 3-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
FOLEY & LARDNER LLP
3000 K STREET N.W.
SUITE 600
WASHINGTON, DC 20007-5109

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