Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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17476132
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Filing Dt:
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09/15/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventor:
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Hirohisa YAMAZAKI
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Title:
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Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Substrate Processing Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-4, KANDAKAJI-CHO |
| CHIYODA-KU |
| TOKYO, JAMAICA 1010045 |
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| EDELL SHAPIRO & FINNAN LLC |
| 9801 WASHINGTONIAN BLVD. |
| SUITE 750 |
| GAITHERSBURG, MD 20878 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 057579 FRAME: 0997. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 3-4, KANDAKAJI-CHO, CHIYODA-KU |
| TOYKO, JAPAN 1010045 |
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| EDELL, SHAPIRO & FINNAN, LLC |
| 9801 WASHINGTONIAN BOULEVARD |
| SUITE 750 |
| GAITHERSBURG, MD 20878 |
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