Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17479569
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Filing Dt:
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09/20/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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Paul V. Pesavento, Collin M. Grove, Douglas P. Riemer
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Title:
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Treatment Methods And Solutions For Improving Adhesion Of Gold Electroplating On Metal Surfaces
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 40 WEST HIGHLAND PARK DRIVE NE |
| HUTCHINSON, MINNESOTA 55350 |
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| MARIA S. SWIATEK |
| 2000 UNIVERSITY AVENUE |
| EAST PALO ALTO, CA 94303 |
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