Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2023
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Application #:
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17027661
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Filing Dt:
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09/21/2020
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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XUESONG RAO, BENFU LIN, BO LI, CHENGANG FENG, YUDI SETIAWAN, YUN LING TAN
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Title:
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VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2, |
| SINGAPORE, SINGAPORE 738406 |
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| GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, 738406 SINGAPORE |
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