Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17457681
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Filing Dt:
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12/06/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventor:
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Mikael Tuominen
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Title:
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Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 5000 JIN DU ROAD |
| SHANGHAI, CHINA 201108 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTMENT |
| 1600 PARKWOOD CIRCLE SE, SUITE 620 |
| ATLANTA, GA 30339 |
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