Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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05/14/2024
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Application #:
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17459296
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Filing Dt:
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08/27/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee et al
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Title:
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SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER, PLLC |
| 1255 CRESCENT GREEN, SUITE 200 |
| CARY, NC 27518 |
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05/09/2024 05:58 PM
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