Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17546583
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Filing Dt:
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12/09/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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Takashi SANO, Hiromasa KATO
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Title:
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Ceramic Copper Circuit Board And Method For Manufacturing The Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| 8, SHINSUGITA-CHO, ISOGU-KU, YOKAHAMA-SHI |
| KANAGAWA-KEN, JAPAN 235-8522 |
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| HARNESS DICKEY (TROY) |
| 5445 CORPORATE DR. |
| SUITE 200 |
| TROY, 48098 UNITED STATES |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE DATA PREVIOUSLY RECORDED ON REEL 058349 FRAME 0086. PREVIOUSLY RECORDED ON REEL 058349 FRAME 0086. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| 8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI |
| KANAGAWA-KEN, JAPAN 235-8522 |
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| HARNESS DICKEY (TROY) |
| 5445 CORPORATE DR. |
| TROY, MI 48098 |
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