Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17418115
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Filing Dt:
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06/24/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Inventors:
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Xianjun Zou, Xingnan Wang
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Title:
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Application Package Splitting and Reassembly Method and Apparatus, and Application Package Running Method and Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, CHINA 518129 |
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| GRANT RODOLPH |
| 4965 PRESTON PARK BOULEVARD, SUITE 195E |
| PLANO, TX 75093 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| B2-5 OF NANFANG FACTORY, NO.2 OF XINCHENG ROAD, SONGSHAN LAKE SCIENCE AND TECHNOLOGY INDUSTRIAL ZONE |
| DONGGUAN, CHINA |
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| HUAWEI TECHNOLOGIES CO., LTD. |
| BUILDING G1-2, HUAWEI INDUSTRIAL BASE, |
| BANTIAN,LONGGANG DISTRICT |
| SHENZHEN, 518129 CHINA |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 15 HUANHU ROAD, SONGSHAN LAKE CAMPUS |
| ROOM 101, BUILDING 4 |
| DONGGUAN, CHINA 523799 |
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| HUAWEI DEVICE CO., LTD. |
| B2-5 NANFANG FACTORY, NO.2 XINCHENG ROAD,SONGSHAN |
| LAKE SCIENCE AND TECHNOLOGY INDUSTRIAL ZONE |
| DONGGUAN, 523808 CHINA |
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