Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/09/2023
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Application #:
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17493264
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Filing Dt:
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10/04/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Inventors:
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Dongyun Lee, Ming Li
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Title:
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METHOD AND APPARATUS TO IMPROVE CONNECTION PITCH IN DIE-TO-WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4453 NORTH FIRST STREET, SUITE 100 |
| SAN JOSE, CALIFORNIA 95134 |
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| ANN WILLIAMS |
| 4453 NORTH FIRST STREET, SUITE 100 |
| SAN JOSE, CA 95134 |
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