Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17555896
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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04/14/2022
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Inventors:
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Shih-Pei Chou, Jiech-Fun Lu
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Title:
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BOND PAD STRUCTURE WITH REDUCED STEP HEIGHT AND INCREASED ELECTRICAL ISOLATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK, LLC |
| 629 EUCLID AVE. |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
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