Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17558500
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Filing Dt:
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12/21/2021
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Publication #:
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Pub Dt:
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04/14/2022
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Inventors:
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Richard E. BORNFREUND, Edward K. HUANG
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Title:
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SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6769 HOLLISTER AVENUE |
| GOLETA, CALIFORNIA 93117 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6769 HOLLISTER AVENUE |
| GOLETA, CALIFORNIA 93117 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6769 HOLLISTER AVENUE |
| GOLETA, CALIFORNIA 93117 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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