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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17431974
Filing Dt:
08/18/2021
Publication #:
Pub Dt:
04/21/2022
Inventors:
Hiroshi HITOKAWA, Tomohide KATAYAMA, Tomotsugu YANO, Rul ZHANG, Aritaka HISHIDA et al
Title:
POLYMER, SEMICONDUCTOR COMPOSITION COMPRISING POLYMER, AND METHOD FOR MANUFACTURING FILM USING SEMICONDUCTOR COMPOSITION
Assignment: 1
Reel/Frame:
057217/0558Recorded: 08/18/2021Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/21/2021
Exec Dt:
04/21/2021
Exec Dt:
04/21/2021
Exec Dt:
04/30/2021
Exec Dt:
04/21/2021
Exec Dt:
04/22/2021
Exec Dt:
04/22/2021
Exec Dt:
04/21/2021
Assignee:
FRANKFURTER STRASSE 250
DARMSTADT, GERMANY 64293
Correspondent:
FAEGRE DRINKER BIDDLE & REATH LLP (WM)
ATTN: INTELLECTUAL PROPERTY GROUP
ONE LOGAN SQUARE, SUITE 2000
PHILADELPHIA, PA 19103-6996

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