Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17485742
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Filing Dt:
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09/27/2021
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Publication #:
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Pub Dt:
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04/21/2022
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Inventors:
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Paul Armand Asentista CALO, Josef MAERZ, Petteri PALM, Sergey YUFEREV, Theng Chao LONG et al
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Title:
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STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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DICKE, BILLIG & CZAJA |
FIFTH STREET TOWERS |
100 SOUTH FIFTH STREET, SUITE 2250 |
MINNEAPOLIS, 55402 UNITED STATES |
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05/09/2024 05:02 PM
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