Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17126102
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Filing Dt:
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12/18/2020
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Publication #:
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Pub Dt:
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04/21/2022
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Inventor:
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Lei Kuang
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Title:
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MODULE EJECTION MECHANISM AND EXPANSION ASSEMBLY HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.5, HSIN-ANN ROAD., HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CITY OF ASSIGNEE PREVIOUSLY RECORDED AT REEL: 54688 FRAME: 770. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 21F., NO.88, SEC.1, HSINTAI 5TH RD., HSICHIH |
| NEW TAIPEI CITY, TAIWAN 22181 |
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| BROOKE FRENCH |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 530 |
| ATLANTA, GA 30339 |
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05/28/2024 11:54 AM
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