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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17572162
Filing Dt:
01/10/2022
Publication #:
Pub Dt:
04/28/2022
Inventors:
Han-Yu Lin, Yi-Ruei Jhan, Fang-Wei Lee, Li-Te Lin, Pinyen Lin, Tze-Chung Lin
Title:
Semiconductor Fabrication System Embedded with Effective Baking Module
Assignment: 1
Reel/Frame:
058608/0366Recorded: 01/10/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2018
Exec Dt:
06/20/2018
Exec Dt:
06/20/2018
Exec Dt:
06/20/2018
Exec Dt:
06/20/2018
Exec Dt:
06/20/2018
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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