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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/12/2022
Application #:
17085740
Filing Dt:
10/30/2020
Publication #:
Pub Dt:
05/05/2022
Inventors:
Ravi N. Kurlagunda, Himanshu Choudhary, Cheng Zhen, Sebastian Turullols, Kaustuv Manji et al
Title:
HIGH THROUGHPUT CIRCUIT ARCHITECTURE FOR HARDWARE ACCELERATION
Assignment: 1
Reel/Frame:
054245/0675Recorded: 11/02/2020Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/25/2020
Exec Dt:
10/28/2020
Exec Dt:
10/15/2020
Exec Dt:
10/19/2020
Exec Dt:
10/30/2020
Exec Dt:
10/15/2020
Exec Dt:
10/21/2020
Exec Dt:
10/26/2020
Exec Dt:
10/31/2020
Exec Dt:
10/19/2020
Exec Dt:
10/16/2020
Exec Dt:
10/17/2020
Assignee:
2100 LOGIC DRIVE
SAN JOSE, CALIFORNIA 95124
Correspondent:
CUENOT, FORSYTHE & KIM, LLC
20283 STATE ROAD 7
STE. 300
BOCA RATON, FL 33498

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