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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11923145
Issue Dt:
03/05/2024
Application #:
17465176
Filing Dt:
09/02/2021
Publication #:
20220139625
Pub Dt:
05/05/2022
Inventors:
Je Hee LEE, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hyoung Uk KIM, Jae Sung PARK
Title:
MULTILAYER CAPACITOR HAVING IMPROVED RELIABILITY BY ADJUSTING GRAIN SIZE OF DIELECTRIC LAYER
Assignment: 1
Reel/Frame:
057376/0569Recorded: 09/02/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, JE HEE
Exec Dt:
08/01/2021
BAIK, SEUNG IN
Exec Dt:
07/30/2021
HONG, JI SU
Exec Dt:
07/30/2021
JANG, EUN HA
Exec Dt:
07/30/2021
KIM, HYOUNG UK
Exec Dt:
07/30/2021
PARK, JAE SUNG
Exec Dt:
08/02/2021
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN, LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20004

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