Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/11/2023
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Application #:
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17580299
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Filing Dt:
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01/20/2022
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Publication #:
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Pub Dt:
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05/05/2022
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Inventors:
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Ichiro HIDE, Hidehiko OKU
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Title:
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Compound Semiconductor Substrate, A Pellicle Film, And A Method For Manufacturing A Compound Semiconductor Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2, KITA 3-JO, NISHI 1-CHOME, CHUO-KU |
SAPPORO-SHI, HOKKAIDO, JAPAN 0600003 |
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WOOD, PHILLIPS, KATZ, CLARK & MORTIMER |
500 W. MADISON STREET |
SUITE 1130 |
CHICAGO, IL 60661-2562 |
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05/02/2024 05:20 PM
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