Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17507136
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Filing Dt:
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10/21/2021
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Publication #:
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Pub Dt:
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05/05/2022
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Inventors:
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Kai-Hung Yu, Hisashi Higuchi, Omid Zandi, Gerrit J. Leusink, David L. O'Meara et al
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Title:
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METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| TOKYO ELECTRON U.S. HOLDINGS, INC. |
| 2400 GROVE BLVD. |
| AUSTIN, TX 78741 |
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05/14/2024 06:48 PM
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