Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17340445
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Filing Dt:
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06/07/2021
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Publication #:
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Pub Dt:
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05/05/2022
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Inventors:
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Yongyeop KIM, Seil OH, Eunji KIM, Kwangwuk PARK, Jihak YU
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Title:
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THROUGH-SILICON VIA (TSV) KEY FOR OVERLAY MEASUREMENT, AND SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING TSV KEY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| LEE IP LAW, P.C. |
| 3141 FAIRVIEW PARK DRIVE |
| SUITE 500 |
| FALLS CHURCH, VA 22042 |
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