Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17434257
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Filing Dt:
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08/26/2021
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Tomoya Tsukui, Takeshi Saito, Karl Heinz Priewasser, Tomoyuki Kanai
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Title:
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BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI |
| 2-CHOME |
| CHUO-KU, TOKYO, JAPAN 1038338 |
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| 13-11 OMORI-KITA 2-CHOME |
| OTA-KU, TOKYO, JAPAN 1438580 |
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| LLEWELLYN RHYS LAWSON, PH.D. |
| CHRISTENSEN O'CONNOR JOHNSON KINDNESS |
| 1201 THIRD AVENUE, SUITE 3600 |
| SEATTLE, WA 98101-3029 |
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