Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17367867
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Filing Dt:
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07/06/2021
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Fong-yuan CHANG, Lee-Chung Lu, Jyh Chwen Frank Lee, Po-Hsiang Huang, Xinyu Bao et al
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Title:
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PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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FINNEGAN, HENDERSON, FARABOW, GARRETT & |
901 NEW YORK AVENUE, NW |
WASHINGTON, DC 20001-4413 |
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05/14/2024 06:33 AM
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