Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17440146
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Filing Dt:
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09/16/2021
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Publication #:
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Pub Dt:
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05/19/2022
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Inventors:
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Keisuke SAKAI, Nanae TANAKA, Kenji MIYASHITA, Go KOBAYASHI
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Title:
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COMBINATION OF MOLD AND RELEASE FILM, RELEASE FILM, MOLD, AND METHOD FOR MANUFACTURING MOLDED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-26-5, ASAKUSABASHI, TAITO-KU, |
| TOKYO, JAPAN 1118620 |
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| STEIN IP., LLC. |
| 1990 M ST, NW |
| WASHINGTON, DC 20036 |
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