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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/30/2024
Application #:
17667734
Filing Dt:
02/09/2022
Publication #:
Pub Dt:
05/19/2022
Inventor:
Jerry Zhijun Zhai
Title:
DEVICES AND METHODS OF VERTICAL INTEGRATIONS OF SEMICONDUCTOR CHIPS, MAGNETIC CHIPS, AND LEAD FRAMES
Assignment: 1
Reel/Frame:
060140/0063Recorded: 06/08/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/08/2020
Assignee:
UNIT 410, NW-20, 99 JINJI LAKE AVENUE
SUZHOU, CHINA 215123
Correspondent:
BAINWOOD, HUANG & ASSOCIATES, LLC
2 CONNECTOR ROAD
WESTBOROUGH, MA 01581
Assignment: 2
Reel/Frame:
064371/0886Recorded: 07/25/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/27/2023
Assignee:
2-B-703, BLOCK 2B, CREATIVE INDUSTRY PARK, NO. 328, XINGHU STREET, SUZHOU INDUSTRIAL PARK, (JIANGSU) PILOT FREE TRADE ZONE
SUZHOU, CHINA
Correspondent:
GOKALP BAYRAMOGLU
1540 WEST WARM SPRINGS RD., SUITE 100 HENDERSON
HENDERSON, NV 89014

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