Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17602394
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Filing Dt:
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10/08/2021
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Publication #:
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Pub Dt:
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05/26/2022
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Inventors:
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Eiichi HONDA, Manabu HIRAKAWA, Yasuaki YOSHIMURA, Yuichiro SATAKE
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Title:
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THERMOPLASTIC RESIN, MOLDED OBJECT, AND MONOMER FOR THERMOPLASTIC RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008324 |
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| GREENBLUM & BERNSTEIN P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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05/02/2024 02:32 PM
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