Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17456156
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Filing Dt:
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11/22/2021
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Publication #:
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Pub Dt:
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05/26/2022
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Inventor:
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Shunya Takeuchi
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Title:
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HOTMELT SILICONE COMPOSITION, ENCAPSULANT, HOTMELT ADHESIVE AND OPTICAL SEMICONDUCTOR DEVISE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, NAGATA-CHO-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1006111 |
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| LK GLOBAL (GM) |
| 7010 E. CONCHISE ROAD |
| SCOTTSDALE, AZ 85253 |
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