Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17442651
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Filing Dt:
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09/24/2021
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Publication #:
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Pub Dt:
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06/02/2022
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Inventor:
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Kenji OTA
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Title:
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MULTI-COMPONENT TYPE THERMALLY CONDUCTIVE SILICONE-GEL COMPOSITION, THERMALLY CONDUCTIVE MATERIAL AND HEAT-EMISSION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 140-8617 |
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| ABBY DAVIS |
| 2211 H.H. DOW WAY |
| MIDLAND, MI 48674 |
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