Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17534156
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Filing Dt:
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11/23/2021
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Publication #:
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Pub Dt:
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06/02/2022
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Inventors:
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Francesco LA VIA, Ruggero ANZALONE
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Title:
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MANUFACTURING METHOD OF A SIC WAFER WITH RESIDUAL STRESS CONTROL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| HAYLEY J. TALBERT |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PIAZZALE ALDO MORO, 7 |
| ROME, ITALY 00185 |
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| HAYLEY J. TALBERT |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| TESSA DEJKUNCHORN |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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