Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17531798
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Filing Dt:
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11/21/2021
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Publication #:
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Pub Dt:
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06/02/2022
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Inventors:
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Soon Hyun KIM, Byung Geun KIM, Byoung Chan LEE
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Title:
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HEATER ASSEMBLY AND BONDING HEAD INCLUDING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31040 |
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| PNJ IP LAW, P.C. |
| 18 ELM STREET |
| WOODBURY, 11797 KOREA, REPUBLIC OF |
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