Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17522067
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Filing Dt:
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11/09/2021
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Publication #:
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Pub Dt:
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06/09/2022
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Inventors:
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Tatsuji NAGAOKA, Hiroki MIYAKE, Hiroyuki NISHINAKA, Yuki KAJITA, Masahiro YOSHIMOTO
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Title:
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WAFER PROCESSING APPARATUS AND METHOD FOR PROCESSING WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1, SHOWA-CHO |
KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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1, TOYOTA-CHO |
TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
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500-1 MINAMIYAMA, KOMENOKI-CHO |
NISSHIN-SHI, AICHI-KEN, JAPAN 470-0111 |
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1, MATSUGASAKI HASHIKAMI-CHO, SAKYO-KU |
KYOTO-SHI, KYOTO, JAPAN 606-8585 |
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POSZ LAW GROUP, PLC |
12040 SOUTH LAKES DRIVE |
SUITE 101 |
RESTON, VA 20191 |
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