Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17543572
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Filing Dt:
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12/06/2021
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Publication #:
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Pub Dt:
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06/09/2022
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Inventor:
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Takuya KUROSAWA
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Title:
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HEAT DISSIPATION PLATE AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-KEN |
| NAGANO-SHI, JAPAN 381-2287 |
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| TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L.P. |
| 1300 EAST NINTH STREET |
| SUITE 1700 |
| CLEVELAND, OH 44114 |
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