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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17425424
Filing Dt:
07/23/2021
Publication #:
Pub Dt:
06/16/2022
Inventors:
Toshiyuki INADA, Kazunari WATANABE, Kenji AIKAWA, Kohei SHIGYOU, Tomohiro NAKATA et al
Title:
FLOW PATH ASSEMBLY, VALVE DEVICE, FLUID CONTROL DEVICE, SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING SAID FLOW PATH ASSEMBLY
Assignment: 1
Reel/Frame:
059018/0426Recorded: 02/15/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2022
Exec Dt:
01/28/2022
Exec Dt:
02/03/2022
Exec Dt:
01/28/2022
Exec Dt:
01/22/2022
Exec Dt:
01/28/2022
Exec Dt:
01/28/2022
Assignee:
3-2 ITACHIBORI 2-CHOME, NISHI-KU, OSAKA-CITY
OSAKA, JAPAN 5500012
Correspondent:
GREENBLUM & BERNSTEIN P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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