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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/17/2023
Application #:
17499002
Filing Dt:
10/12/2021
Publication #:
Pub Dt:
06/16/2022
Inventors:
Shinji UEDA, Osamu HASHIGUCHI
Title:
DEVICE INCLUDING A CIRCUIT MEMBER SEALED BY A FILM, AND METHOD OF FORMING THE DEVICE
Assignment: 1
Reel/Frame:
057763/0085Recorded: 10/12/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/29/2021
Exec Dt:
09/29/2021
Assignee:
21-1, DOGENZAKA 1-CHOME
SHIBUYA-KU, TOKYO, JAPAN 150-0043
Correspondent:
HOLTZ, HOLTZ & VOLEK PC
630 NINTH AVE
SUITE 1010
NEW YORK, 10036 UNITED STATES

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