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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11892550
Issue Dt:
02/06/2024
Application #:
17644739
Filing Dt:
12/16/2021
Publication #:
20220196782
Pub Dt:
06/23/2022
Inventors:
Hoang Viet Nguyen, Neha Dawar, Khuong N. Nguyen, Yuming Zhu, Yi Yang, Jiho Shin, Songwei Li et al
Title:
THREE-DIMENSIONAL ANGLE OF ARRIVAL CAPABILITY IN ELECTRONIC DEVICES
Assignment: 1
Reel/Frame:
065850/0799Recorded: 12/12/2023Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DAWAR, NEHA
Exec Dt:
09/20/2023
NGUYEN, HOANG VIET
Exec Dt:
09/20/2023
NGUYEN, KHUONG N.
Exec Dt:
09/19/2023
LI, SONGWEI
Exec Dt:
09/19/2023
ZHU, YUMING
Exec Dt:
09/19/2023
NG, BOON LOONG
Exec Dt:
09/19/2023
YANG, YI
Exec Dt:
09/21/2023
KANG, MOONSEOK
Exec Dt:
12/12/2023
SHIN, JIHO
Exec Dt:
09/20/2023
KIM, HYUNCHUL
Exec Dt:
09/21/2023
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
DOCKET CLERK - SAMS
P.O. DRAWER 800889
DALLAS, TX 75380

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