Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17603254
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Filing Dt:
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10/12/2021
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Publication #:
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Pub Dt:
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06/23/2022
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Inventor:
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Hiroko MORI
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Title:
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SEMICONDUCTOR-MODULE EXTERNAL TERMINAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1-56, NISHI-AWAJI, HIGASHI-YODOGAWA-KU |
| OSAKA-SHI |
| OSAKA, JAPAN 533-0031 |
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| MARK D. SARALINO |
| 1621 EUCLID AVENUE |
| 19TH FLOOR |
| CLEVELAND, OH 44115 |
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Assignment:
2
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CORRECT TYPOGRAPHICAL ERROR IN ADDRESS OF ASSIGNEE IN ASSIGNMENT COVER SHEET; REEL/FRAME: 057788/0243
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| 3-1-56, NISHI-AWAJI, HIGASHI-YODOGAWA-KU |
| OSAKA-SHI |
| OSAKA, JAPAN 533-0031 |
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| MARK D SARALINO |
| RENNER, OTTO, BOISSELLE & SKLAR, LLP 1621 EUCLID A |
| 1621 EUCLID AVENUE, 19TH FLOOR |
| CLEVELAND, OH 44115 |
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