Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17127750
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Filing Dt:
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12/18/2020
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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Li-Sheng Weng, Yu-Chih Chen, Chaoqi Zhang
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Title:
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FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMPLOYING AN ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELD STRUCTURE IN UNUSED FAN-OUT AREA FOR EMI SHIELDING, AND RELATED FABRICATION METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| W&T/QUALCOMM |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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