Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17600403
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Filing Dt:
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09/30/2021
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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Jae Sik MIN, Jae Yeop LEE, Jae Suk PARK, Byoung Gu CHO
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Title:
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LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (CHANGDUK DONG, YONGIN TECHNO VALLEY KNOWLEDGE INDUSTRY CENTER) |
| A907-HO, A-DONG A906-HO, 357, GUSEONG-RO, GIHEUNG-GU |
| YONGIN-SI GYEONGGI-DO, KOREA, REPUBLIC OF 16914 |
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| THE BELLES GROUP, P.C. |
| 1800 JOHN F. KENNEDY BOULEVARD |
| SUITE 1010 |
| PHILADELPHIA, PA 19103 |
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