Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17561360
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Filing Dt:
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12/23/2021
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Publication #:
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Pub Dt:
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06/30/2022
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Inventors:
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Akira MINAMI, Keisuke NISHIHARA
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Title:
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MEDIUM HAVING HEAT-SENSITIVE MEDIUM AND ADHESIVE MEDIUM WHOSE WIDTH IS GREATER THAN WIDTH OF HEAT-SENSITIVE MEDIUM, CARTRIDGE INCLUDING THE MEDIUM, AND METHOD FOR CREATING THE MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 15-1 NAESHIRO-CHO, MIZUHO-KU |
| NAGOYA, JAPAN 467-8561 |
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| KENEALY VAIDYA LLP |
| 3050 K STREET, N.W. |
| SUITE 302 |
| WASHINGTON, DC 20007 |
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